Weekly Roundup: January 13, 2026 copertina

Weekly Roundup: January 13, 2026

Weekly Roundup: January 13, 2026

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In this first episode of the new year, Josh Corman and Chad Jackson kick off 2026 by breaking down the engineering implications of the latest innovations from CES, including advancements in physical AI, autonomous sensors, and next-gen processors. The conversation then shifts to exclusive new research findings on engineering change initiatives. Chad reveals data showing a surprising mix of high success rates and high resistance, explaining why “resistance is a form of feedback” that leaders should welcome rather than fear. Finally, Chad challenges the industry consensus on Product Lifecycle Management (PLM), arguing that its value doesn’t necessarily depend on enterprise-wide adoption, and shares a roadmap for the upcoming InsightEX platform. Key Topics & Takeaways
  • CES 2026 Recap: Highlights from the show floor, including AI chips from Tesla and Arm, Siemens’ digital twin updates, and the rise of “physical AI” in robotics.
  • The Competency Gap: How organizations can balance the pressure to develop new skills (AI, cloud, cybersecurity) while still hitting product delivery deadlines.
  • Research Reveal: New data from late 2025 shows an 82% success rate for initiatives, yet 42% of organizations still encounter high or extreme resistance.
  • Rethinking Resistance: Why pushback from engineers is often a sign of engagement and how change agents can use it to build better processes.
  • The PLM Debate: Chad offers a counterpoint to the idea that PLM is low-value unless extended to the enterprise, highlighting gaps in how current tools handle software and cybersecurity.
  • InsightEX Update: A sneak peek at the launch of the new resource library, community forums, and online assessment tools for engineering leaders.
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