In this episode, we explore the latest developments in AI hardware, including NVIDIA's NV HBM, Astera's Leo family, Velaura's pivot to robotics and low-power design, and insights from MLPerf benchmarks. If you're a semiconductor or AI professional, join us for a discussion of the future of AI processing, communications, and industry trends. 00:00 Introduction and episode overview

01:06 NVIDIA's NV-HBM and custom memory interface

03:16 Moving memory controllers to base die and implications

06:31 Astera's second-generation CXL memory controllers

09:17 Are CPUs made for agentic AI just hype?

13:55 Is local AI worthwhile?

15:06 What is the CPU market TAM?

19:17 Having received a Series A, what is Velaura doing?

25:19 MLPerf benchmarks and AMD's performance

31:25 What's the Qualcomm-Huawei agreement about?

32:55 What's the Qualcomm-Amazon agreement about?

38:48 Arm's new CPU cores and future prospects

41:27 Closing remarks and upcoming events

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Caliente and Picante! Joe and Bob Inside Hot Chips 2026 to Find The Designs Shaping AI Semiconductors.

Join Byrne-Wheeler Report hosts Joe and Bob as they discuss key disclosures from Hot Chips 2026, including Intel’s Diamond Rapids Xeon, AMD’s Helios MI450 platform, NVIDIA’s LPX/LPU architecture, Cerebras’s CS-4 wafer-scale engine, and OpenAI’s Jalapeño ASIC. If you work in AI hardware, semiconductors, GPUs, CPUs, interconnects, or data center architecture, this episode delivers insight unavailable in press releases vendor pitches.

00:00 Episode Highlights

00:53 Introduction and overview of Hot Chips 2026

02:51 Intel Crescent Island GPU

08:05 Intel Diamond Rapids CPU

13:59 AMD Helios and MI400

18:22 Nvidia Scale-In Networks, Bluefield 4 DPU

21:10 Nvidia Groq LPX LP30

29:20 Cerebras WSE-4

34:23 OpenAI Jalapeno

39:23 Goodbyes

https://wheelersnetwork.com

https://XPU.pub

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In Episode 16 of the Byrne-Wheeler Report, Joe and Bob discuss the latest developments in AI hardware, including disclosures at AMD's Advancing AI day, NVIDIA Vera, and upcoming conferences Hot Chips and OCP APAC. They analyze new processor architectures, interconnect standards, and market implications for AI and data center computing.

00:00 Introduction and episode overview

00:24 Upcoming Conferences: Hot Chips and OCP APAC

01:07 Intel Processor and GPU Disclosures at Hot Chips

04:24 AMD AI Day: Helios Wide Rack and Interconnect

06:54 AMD AI Day: EPYC Venice Gen 6 Processors

10:37 AMD AI Day: Verano and XGMI/UALink/SUE-T Interconnect for Helios 500

12:09 AMD AI Day: GPU Roadmap--MI 500 Scales Beyond 72 GPUs and Ratchets Up Performance

15:31 AMD AI Day: MI455X GPU Architecture Improvements and Performance vs Nvidia Rubin

16:44 AMD AI Day: Pensando Roadmap and Helios Scale-Out Bandwidth

18:03 AMD AI Day: Microsoft Azure and Anthropic Customer Announcements

20:07 Alphabet/Google Earnings and AI Infrastructure Investments

22:37 Introduction to Astera Labs Taurus Re-Timers and Re-Drivers

26:07 NVIDIA Vera: A High-Bandwidth CPU for GPU Hosts and App Sandboxing

30:13 Closing Remarks and OCP-APAC, Hot Chips Reminders

Joe: https://xpu.pub

Bob: https://wheelersnetwork.com

#AI hardware, #AMD, #NVIDIA, Hot Chips, #OCP APAC, processor architecture, interconnect standards, data center, AI inference, #GPU

AMD's AI Day 2026 - https://www.amd.com/en/corporate/events/advancing-ai.html

NVIDIA Vera Platform - https://www.nvidia.com/en-us/data-center/vera-cpu/

Hot Chips Conference - https://www.hotchips.org

OCP APAC Summit - https://www.opencompute.org/summit/2026-ocp-apac-summit/theme

Astera Labs Taurus Re-timers and Re-drivers - https://www.asteralabs.com/news/astera-labs-expands-taurus-family-with-industrys-first-ocp-standard-footprint-compatible-3-2t-smart-retimers-and-smart-redrivers/

Google Cloud Earnings Report Q2 2026 - https://abc.xyz/investor/earnings/

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